Halogen-free PCB Reliability Test and Failure Analysis
The Printed Circuit Board (PCB or PWB) is the base of electronic products. A PCB integrates and connects various electronic components to form a product assembly.
PCB has a history of several decades. In the recent trend of miniature and light-weight electronic products added with promotion of lead-free processes, the assembling temperature of either reflow soldering or wave soldering gets higher, therefore the potential influence resulting from the additional thermal stress against the tranditional PCB becomes worse, hence product defects attributed to PCBs also worsen when compared to that before the transfer to lead-free processes. Although material suppliers developed high Tg substrate or improved hardening agents to overcome the thermal stress issue, other problems occurred, e.g., reduced Bond Pad Strength, poor hole-drilling quality, and Conductive Anode Filament (CAF) effect. Therefore PCB Reliability Test once more becomes highly focused.
Apart from the issue of lead-free application, international non-government organizations (NGO) actively promote Halogen Free processes. Meeting requirements of lead-free processes and Halogen limitations, DEKRA has developed a reliability test addressing properties of PCB materials to assist customers in obtaining certificate of preliminary product reliability tests or product sampling analyses.
- Temperature Cycling Test and Dynamic Low-Resistance Measurement
- Wet/dry Thermal Shock Tests
- Electrochemical Migration Test
- Copper Trace Tension Test and solder pad bond strength test
- Simulation of Heat Resistance Dynamic thermal oil test
- CTE and Tg Measurement
- Bending Test
- Mechanical Shock Test
- Failure Analysis