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Failure Analysis

Failure analysis is mainly to estimate the failure mode and find out the failure root cause and failure mechanism with the help of various test instruments and analysis methods, so as to help customers put forward suggestions to prevent the failure again.

3D OM (3D Optical microscope) has large depth of field and advanced measuring functions to focus on the object under test of different heights at different angles and obtain clear images for observation. 3D OM is suitable for the inspection and failure analysis of electronic part soldering.

Main Application

  • Detection of potential PCB defects, such as nodules, weave exposure, glass fiber exposure, solder mask, text ect.
  • Detection of potential detects in electronic products, such as poor soldering,solder ball deformation.
  • Appearance check and analysis of active and passive components.
  • Analysis and measurement of all materials.

For the position where the sample cannot be detected by appearance, the contrast effect generated by X-Ray penetrating material with different densities can be used to form an image, and then the problem area inside the object can be observed without damaging the object.

Main Application

  • Defect inspection during IC packaging such as inspections of wire bonding, open/short, bubbles in epoxy or plastic.
  • Potential process defects in PCBs and carrier boards, such as circuit miss-align or bridge and open circuit, quality inspection of plated via process, ect.
  • Defect inspection in all electronic products, including open circuit, short or abnormal connections.
  • Solder ball integrity inspection of BGA and flip chip packages, including solder ball deformation, crack, cold soldering, short, and blow hole.
  • Crack inspection of high-density plastics or cavity inspection of metals.

Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness

Main Application

  • Normally used to detect delamination, cracks, or void inside the package.

The sample is encapsulated with resin to prevent damage to the sample due to stress during grinding, and then grind it to the required location with sandpaper and polish it to obtain high-quality section soldering. Cross section is the most intuitive and commonly used test method

Main Application

  • Soldering quality inspection: solder or component defect, IMC measurement.
  • PCB circuit inspection.
  • Film thickness measurement.
  • Metallographic anlysis.

Scanning Electron Microscope & Energy Dispersive Spectrometer (SEM&EDS) has the characteristics of large depth of field and continuously variable magnification. The morphology and surface structure of various samples are observed. And EDS can do qualitative and semi-quantitative element analysis quickly and effectively.

Case Sharing

SEM image:

EDS analysis:

Main Application

  • Observation of various material surface microstructures.
  • The tin whisker measurement in solder surface of component before and after assembles.
  • The plating thickness measurement.
  • The observation of component and solder section structure. For examples, wire bonding, voids, micro crack and IMC ect.
  • Material element analysis.

Contact us

DEKRA Asia Pacific

400 688 1925
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